With our Plating Electronic GmbH POWER PULSE REVERSE power supply, you can match the current curves and voltage sequences ideally to your applications.
Description
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Plating electronic GmbH (pe) has developed a pulse power supply to assist the PCB industry in meeting its demands for greater efficiency and increased throughput of acid copper plating processes.
The versatile switch mode pe Power Supplies are capable of pulse as well as straight DC current. When operating in pulse mode, the system produces a perfect square pulse.
Features
Switchmode Technology
Complex waveforms
Ripple < 1% (relative to related DC value)
1 to 16 pulse steps, individual programmable
Forward and Reverse operation
Constant current regulation
Voltage monitoring
Start – Stop ramp
DC current after pulse sequence
External release contact
Short circuit and open circuit protected
Parameters individually adjustable, even during operation
Rectangular current wave shape
Application
Electrodeposition and formation of coatings for catalytic chemical synthesis
Automotive, Aviation, Space
Laboratory Plating Lines
Printed Circuit Boards
Pulse Plating
Testing
To contact Australian Rectifiers about Plating Electronic Pulse Reverse Power Supply | PE 86CB use Get a quote.
Plating electronic GmbH (pe) has developed a pulse power supply to assist the PCB industry in meeting its demands for greater efficiency and increased throughput of acid copper plating processes.
The versatile switch mode pe Power Supplies are capable of pulse as well as straight DC current. When operating in pulse mode, the system produces a perfect square pulse.
Features
Switchmode Technology
Complex waveforms
Ripple < 1% (relative to related DC value)
1 to 16 pulse steps, individual programmable
Forward and Reverse operation
Constant current regulation
Voltage monitoring
Start – Stop ramp
DC current after pulse sequence
External release contact
Short circuit and open circuit protected
Parameters individually adjustable, even during operation
Rectangular current wave shape
Application
Electrodeposition and formation of coatings for catalytic chemical synthesis