IEI Integration Corp. - WAFER-TGL-U 3.5" SBC Board Computer Intel® Tiger Lake Processor Get latest price

WAFER-TGL-U is ideal for space-constraints installation, notably AGVs (Automated Guided Vehicle), AMR (Autonomous Mobile Robot), and small cabinets in factories. It features complete I/O interfaces such as three 2.5 GbE LAN ports for motion control / IP cameras, an M.2 B-key with SIM slot for LTE cellular communication, and USB 3.2 Gen 2, serial ports for connecting sensors and communicating with other devices.

Compared with the previous generation, the WAFER-TGL features a high-performance CPU and GPU, along with AI deep learning capabilities in a compact 3.5" form factor. The WAFER-TGL provides an effortless upgrade, allowing new version replacement to improve performance without changing the original mechanical design.

Key Features:

• 3.5" SBC with Intel® Tiger Lake-UP3 on Board SOC Processor, Support SO-DIMM DDR4-3200 Memory
• Support Quadruple Independent Display: 2 x HDMI 1.4, 1 x DP 1.4, 1 x iDPM
• High-speed I/O interface: 4 x USB 3.2 gen 2 (10Gb/s), SATA (6Gb/s)
• Support Three Intel®I225V 2.5GbE Network Port
• Support M.2 A Key, B Key Extension

To contact ICP Electronics about IEI Integration Corp. WAFER-TGL-U 3.5" SBC Board Computer Intel® Tiger Lake Processor use Get a quote.

WAFER-TGL-U is ideal for space-constraints installation, notably AGVs (Automated Guided Vehicle), AMR (Autonomous Mobile Robot), and small cabinets in factories. It features complete I/O interfaces such as three 2.5 GbE LAN ports for motion control / IP cameras, an M.2 B-key with SIM slot for LTE cellular communication, and USB 3.2 Gen 2, serial ports for connecting sensors and communicating with other devices.

Compared with the previous generation, the WAFER-TGL features a high-performance CPU and GPU, along with AI deep learning capabilities in a compact 3.5" form factor. The WAFER-TGL provides an effortless upgrade, allowing new version replacement to improve performance without changing the original mechanical design.

Key Features:

• 3.5" SBC with Intel® Tiger Lake-UP3 on Board SOC Processor, Support SO-DIMM DDR4-3200 Memory
• Support Quadruple Independent Display: 2 x HDMI 1.4, 1 x DP 1.4, 1 x iDPM
• High-speed I/O interface: 4 x USB 3.2 gen 2 (10Gb/s), SATA (6Gb/s)
• Support Three Intel®I225V 2.5GbE Network Port
• Support M.2 A Key, B Key Extension

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To contact ICP Electronics about IEI Integration Corp. WAFER-TGL-U 3.5" SBC Board Computer Intel® Tiger Lake Processor use Get a quote.